Modeling Interconnect and Design-in Passives for Efficient Coupled Analysis Luis Miguel Silveira - INESC-ID, Portugal Abstract The ever increasing speeds and shrinking feature sizes typical of state of the art integrated circuits designs have made coupling due to interconnect and packaging a very important, sometimes dominant, factor in system behavior. Proper circuit verification requires accurate modeling of such effects in order to allow coupled circuit interconnect simulations to be performed. Nowadays, the dense interconnections and packaging structures used in compact electronic systems often produce electrical and magnetic interactions which interfere with system performance. Such effects are difficult to model and simulate because they occur only as a result of an interaction in a complicated geometry of conductors, and the circuitry connected to those conductors. The obvious solution, namely straightforward coupling of circuit simulators with field solvers is prohibitive because of the large computational effort associated. Furthermore, the detailed electromagnetic information provided is also unnecessary from a circuit perspective. Therefore, one often attempts to capture the main electromagnetic effects into a compact model for the interconnect structure, and couple this to a circuit simulation program. In this process, Model Order Reduction methods play an increasingly important role. In this tutorial, we review state of the art techniques that can be use to model accurately interconnect and packaging structures, as well as designed-in passives. In particular we review Krylov-subspace techniques which are currently the techniques of choice for model reduction and generation of compact, accurate models. We discuss the efficiency and accuracy of the resulting methods, as well as the preservation of relevant system properties. We also take a critical look at the robustness and automation available in such methods.