
No dia 16 de fevereiro às 13:30h (Horário de Brasília) ocorrerá a palestra “Design-For-Manufacturability for Nano-Scale CMOS Technology” com Prof. Yongfu Li da Shanghai Jiao Tong University, China
Para acessar a palestra, clique aqui.
YouTube Live @ IEEE CASS Rio Grande do Sul Chapter
Prof. Yongfu Li, Shanghai Jiao Tong University, China
Design-For-Manufacturability for Nano-Scale CMOS Technology
Abstract:
In semiconductor manufacturing, physical design is a process of turning a circuit into geometric shapes (layout), which will be manufactured onto the wafer in various chemical, mechanical and electrical steps. As geometric feature sizes continue to shrink, it is difficult to fabricate these shapes precisely onto the wafer without any defects. Manufacturing constraints must be applied during the physical design phase. It has become increasingly important to have access to different types of physical verification and enhancement tools that can check a design’s manufacturability, identify any possible defects, and fix them. These products are known as Design for Manufacturability (DFM) tools. The seminar presents the different types of DFM tools and how deep learning techniques can help to accelerate the development of DFM tools.
Short CV:
Yongfu Li (S’09–M’14-SM’18) is currently a tenured associate professor in Shanghai Jiao Tong University, China. He was a research engineer with NUS, from 2013 to 2014. He was a senior engineer (2014-2016), principal engineer (2016-2018) and member of technical staff (2018-2019) with GlobalFoundries, as a Design-to-Manufacturing (DFM) Computer-Aided Design (CAD) research and development engineer. He is also serving as the IEEE CASS Board of Governors (R10 Member at Large), IEEE CASS Standard Activities Sub-Division Chair, and IEEE JETCAS Senior Editor and so on. He has involved in different roles in many prestigious IEEE CASS conferences (ISCAS, ISICAS, AICAS, NEWCAS, ISVLSI, ASP-DAC, and APCCAS) and regional activities. He has organized several special sessions and issues in IEEE CASS Journals and Conferences.