O 19th International Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW 2014), acontecerá de 17 a 19 de setembro, em Porto Alegre – RS, e o prazo para submissão de trabalhos é até o dia 16 de maio.
CALL FOR PAPERS
Scope
Two decades ago, the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design issues related to electronic systems with digital and analog components. In view of accelerated developments in heterogeneous system design and production, IMSTW was expended in 2008 to include new topics that address test, design for test, reliability and manufacturability of today’s sensors and sensor-based systems, as well as emerging devices and systems. Renamed to include sensors and systems, IMS3TW aims to bring together a community of researchers working on test and design issues related to the next-generation of devices, circuits and systems.
Submissions
Prospective authors are invited to submit papers on the topics of interest. Submissions should be via the workshop web-site and consist of either an extended summary of at least 750 words or a full paper (of up to 6 pages). Submissions are due no later than May 2nd, 2014. Authors will be notified by June 27th, 2014 and authors of accepted papers should submit final manuscripts by July 25th, 2014. The accepted papers will be published by Conference Publishing Services (CPS) in proceedings available on the IEEE digital library (IEEEXplore).
Proposals for special sessions, hot topics, and panel sessions are also invited. Proposals should include a title, name and contact information of the organizer(s). They should be made by e-mail to:
IMS3TW 2014 also plans to deliver a Best Student Paper Award. Details are available on the workshop web-site.
Key Dates
· Submission deadline: May 16th, 2014
· Notification of acceptance: June 27th, 2014
· Camera-ready full paper: July 25th, 2014
Additional Information
General Information Submission Information
General Chair Program Chair
Marcelo Lubazsewski Florence Azais
Committees
General Chair
M. Lubazsewski, CEITEC, BR
General Co-Chair
B. Kaminska, Simon Fraser U., CA
Program Chair
F. Azais, LIRMM, FR
Program Co-Chairs
Signal: H. Stratigopoulos, TIMA, FR
Systems: M. Slamani, IBM, USA
Sensors: M. Sawan, Ecole Polytechnique, CA
Finance Chair
T. Balen, UFRGS, BR
Panel Chair
A. Ivanov, UBC, CA
Special Session Chair
K. Chakrabarty, Duke U., USA
Publicity Chairs
S. Mir, TIMA, FR
R. Reis, UFRGS, BR
Publications Chair
P. Rech, UFRGS, BR
Local Arrangements
F. Kastensmidt, UFRGS, BR
Program Committee
S. Abdennadher, Intel, USA
J. Abraham, University of Texas, USA
L. Balado, UPC, Spain
T. Balen, UFRGS, Brazil
S. Bernard, LIRMM, France
A. Chatterjee, Georgia Tech., USA
D. Cheng, Iowa State Univ., USA
K.-T. Cheng, UCSB, USA
E. Cretu, University of British Columbia, Canada
J. Dabrowski, Linkoping University, Sweden
G. Farber, Agilent Technologies, USA
E. de Foucauld, CEA-LETI, France
H.-C. Hong, National ChiaoTung University, Taiwan
J.L. Huang, National U. Taiwan, Taiwan
D. Keezer, Georgia Tech., USA
H. Kerkhoff, MESA/U. Twente, Netherlands
H. Kobayashi, Gunma University, Japan
G. Leger, IMSE-CNM, Spain
J. Machado da Silva, University of Porto, Portugal
Y. Makris, Yale University, USA
S. Mir, TIMA, France
S. Ozev, Arizona State U., USA
N. Samotaev, NRNU MEPhI, Russia
S. Sattler, Erlangen University, Germany
J. Silva-Martinez, Texas A&M University, USA
A. Valdes Garcia, IBM T.J. Watson Research Center, USA
H. M. Von Staudt, Dialog Semiconductors, Germany
P.-Y. Wang, Mediatek, Taiwan
Y. Xing, NXP, Netherlands
Steering Committee
K. Chakrabarty, Duke U., USA (chair)
F. Azais, LIRMM, France (vice-chair)
J. Abraham, University of Texas, USA
A. Chatterjee, Georgia Tech., USA
K.-T. Cheng, UCSB, USA
B. Courtois, CMP, France
A. Ivanov, UBC, Canada
B. Kaminska, Simon Fraser U., Canada
H. Kerkhoff, MESA/U. Twente, Netherlands
S. Mir, TIMA, France
A. Osseiran, Edith Cowan U., Australia
M. Renovell, LIRMM, France
A. Richardson, U. Lancaster, UK
For more information, visit us on the web at: http://www.inf.ufrgs.br/ims3tw/
Call For Papers (PDF)